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Turing 
Sovrano AI
SME Careers
Respondent
AfterQuery
micro1
Handshake AI
Anyone AI
REX / RemoExperts
Mercor
AI Training · Project
Signal Integrity and Electromagnetic Simulation Engineer (PCB Design)
Evaluate thermal performance and airflow for PCB assemblies and electronic systems.
PLATFORMTuring
LOCATIONRemote · eligibility varies
PAYNot disclosed
SCHEDULESee role requirements
LAST CHECKED11 Nov 2026
THE OPPORTUNITY
Put your skills to work.
Evaluate thermal performance and airflow for PCB assemblies and electronic systems.
- Skills
- Thermodynamics and Statistical Physics
- Role group
- Engineering
- Location
- remote
About Turing:
Based in San Francisco, California, Turing is the world’s leading research accelerator for frontier AI labs and a trusted partner for global enterprises deploying advanced AI systems.
Role Overview
Responsible for developing and executing thermal and CFD simulation workflows for PCB assemblies and electronic systems, evaluating heat dissipation, temperature distribution and cooling effectiveness, and generating technically validated simulation evidence.
Key Responsibilities
- Perform thermal analysis of PCB assemblies, electronic components and enclosures.
- Analyse heat conduction, convection and, where applicable, radiation.
- Develop CFD models to evaluate airflow, cooling performance and temperature distribution.
- Use OpenFOAM for thermal and CFD simulations.
- Use Gmsh or equivalent open-source tools for geometry preparation and mesh generation.
- Define thermal boundary conditions, material properties, component power losses and simulation parameters.
- Evaluate component and PCB temperatures, thermal hotspots and cooling effectiveness.
- Develop Python-based automation and post-processing workflows.
- Assess mesh independence, convergence and numerical stability.
- Correlate simulation results with analytical calculations and available reference data.
- Document modelling assumptions, limitations, results and verification evidence.
Required Skills
- Strong fundamentals in heat transfer, thermodynamics and fluid mechanics.
- Practical experience in CFD and thermal simulation.
- Knowledge of conduction, natural/forced convection and radiation.
- Experience with OpenFOAM or equivalent CFD tools.
- Familiarity with Gmsh or other mesh-generation tools.
- Understanding of material properties, thermal boundary conditions and heat-source modelling.
- Python scripting for automation and simulation post-processing.
- Ability to interpret simulation results and assess numerical accuracy.
Preferred Qualifications
- Bachelor's or Master's degree in Mechanical, Thermal, Aerospace or related Engineering.
- 5+ years of relevant experience in CFD, thermal engineering or electronics cooling.
- Experience with PCB thermal analysis, power electronics, semiconductor cooling or electronic enclosures.
Project Details
- Contract Start Date: Expected to start as soon as possible
- Engagement: ~13 weeks (with potential chances of extension)
- Commitment - 40 hours/week
- Engagement Type: Contract
- Selection process: 1 AI Interview and 1 Interview with our team
Role details are copied from the Turing listing and can change. Check the platform before you apply.
Relevant skills
Thermodynamics and Statistical Physics
A few things to check
- Location and experience requirements.
- Schedule, compensation, and assessment process.
- Current availability on Turing.
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